Method for creating and preserving alignment marks for aligning mask layers in integrated circuit manufacture
AssigneeConexant Systems, Inc.
InventorDaniel M. So
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AssigneeConexant Systems, Inc.
InventorDaniel M. So
Estimating the term…
A method for creating and preserving alignment marks used for aligning mask layers in integrated circuit formation including the steps of creating a first set of marks within a reference layer to form a basic alignment mark, creating a second set of marks overlapping the first set of marks and positioned perpendicular to the first set of marks in the same reference layer to form a preservation pattern, and etching the reference layer to form a substantially checkerboard-type pattern where portions of the first set of marks are recessed within a thickness of the reference layer. After creating the checkerboard-type pattern formed from the first and second marks, a first metal a layer may be deposited to fill in any recesses contained within the pattern. CMP follows without damaging the segmented portions of the first set of marks which lie recessed within a thickness of the reference layer. Finally, the preserved portions of the first set of marks are aligned with pattern marks for a second metal layer.
A method for aligning mask layers in the formation of integrated circuits on semiconductor wafers comprising the steps of:
A method for creating and preserving alignment marks used for aligning mask layers in the formation of integrated circuits on semiconductor wafers comprising the steps of:
A method for creating and preserving alignment marks for proper alignment of mask layers in integrated circuit manufacture comprising:
Dependencies are inferred from the claim text.