Apparatus for coupling a test head and probe card in a wafer testing system

A semiconductor testing apparatus comprising:

• a test head coupling structure having first electrical interconnection elements;
• a probe card coupling structure having second electrical interconnection elements;
• a first plate having first locations for receiving the first interconnection elements;
• a second plate having second locations for receiving the second interconnection elements;
• conduits extending between the first plate and the second plate, each of the conduits comprising at least one of a plurality of conducting members having a first end accessible by one of the first interconnection elements and a second end accessible by one of the second interconnection elements, some of the first interconnection elements thereby being electrically coupled to at least some of the second interconnection elements;
• said conduits arranged in a plurality of rows of said conduits;
• a first and a second conductive dividing element, each having a respective planar surface;
• said first dividing element and said second dividing element situated between a first two and a second two of said plurality of rows of conduits, respectively;
• said first and second dividing element each spanning across more than one of said conduits in a first direction and extending between said first plate and said second plate in a second direction orthogonal to said first direction;
• wherein said planar surface of said first dividing element and said planar surface of said second dividing element being one of:
• non parallel;
• and
• offset relative to each other in said first direction.

An apparatus for coupling a test head and a probe card in a wafer testing system, the apparatus comprising:

• first plate having first locations;
• a second plate having second locations;
• conduits extending between the first plate and the second plate, each of the conduits comprising at least one of a plurality of conducting members having a first end accessible via one of the first locations and a second end accessible via one of the second locations
• said conduits arranged in a plurality of rows of said conduits;
• a first and a second conductive dividing element, each having a respective planar surface;
• said first dividing element and said second dividing element situated between a first two and a second two of said plurality of rows of conduits, respectively;
• said first and second dividing element each spanning across more than one of said conduits in a first direction and extending between said first plate and said second plate in a second direction orthogonal to said first direction;
• wherein said planar surface of said first dividing element and said planar surface of said second dividing element being one of:
• non parallel;
• and
• offset relative to each other in said first direction.