Plasma treatment of conductive layers
AssigneeThe Trustees of Princeton University
InventorsJames C. Sturm, Chung-Chih Wu
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Abstract
A method for modifying the surface properties such as work function of semiconducting and conducting layers by plasma treatment. Also disclosed are electrical devices such as organic light emitting devices of enhanced performance owing to the use of plasma treatment-modified semiconducting or conducting layers.
Claims38
An electrical device comprising a semiconducting or conducting layer having a work function modified by plasma treatment, said plasma treatment selected from the group consisting of treatment with an oxygen-containing species thereby increasing the work function by about 100 to about 300 meV and treatment with a hydrogen-containing species thereby decreasing the work function by about 100 meV.
An organic light emitting device comprising:
- a plasma treated contact layer;
- an organic layer over said plasma treated contact layer;
- and
- a second contact layer over said organic layer, said plasma treated contact layer comprising a contact layer having a work function, wherein said contact layer is treated with a plasma treatment selected from the group consisting of treatment with an oxygen-containing species thereby increasing the work function by about 100 to about 300 meV and treatment with a hydrogen-containing species thereby decreasing the work function by about 100 meV.
A method of modifying a work function of a conductor or semiconductor surface comprising:
- selecting plasma treatment appropriate to modify said work function;
- and
- subjecting said conductor or semiconductor to said plasma treatment, said plasma treatment selected from the group consisting of treatment with an oxygen-containing species thereby increasing the work function by about 100 to about 300 meV and treatment with a hydrogen-containing species thereby decreasing the work function by about 100 meV.
A method of making an organic light emitting device comprising:
- providing a first contact layer having a work function;
- treating said first contact layer with a plasma;
- placing an organic layer over said contact layer;
- and
- placing a second contact layer over said organic layer, said step of treating said first contact layer comprising treating said first contact layer with a plasma treatment selected from the group consisting of treatment with an oxygen-containing species thereby increasing the work function by about 100 to about 300 meV and treatment with a hydrogen-containing species thereby decreasing the work function by about 100 meV.
Dependencies are inferred from the claim text.