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US 6,259,039 B1Granted
Surface mount connector with pins in vias
AssigneeIntel Corporation
InventorsRobert J. Chroneos, Jr., Hamid Ekhlassi
Life of this patent
Estimating the term…
Abstract
A surface mountable pin connector has a substrate or a circuit board carrier, which has a number of through holes or vias formed therein, and a number of connector pins, each of which is soldered into a respective one of the through holes with high melt temperature solder. A damming device or protrusion is located on each pin nearer to the shoulder than typical interference fit protrusions. The damming device is sized and shaped to completely block the through hole or via.
Claims17
A circuit interconnect, comprising:
- a circuit board carrier having a plurality of plated through holes formed therein;
- a plurality of pins, each pin being soldered into a respective one of the plurality of plated through holes;
- a plurality of lands located over the through holes;
- and
- a plurality of solder balls attached to the lands.
2 more elements
A circuit interconnect, comprising:
- a circuit board carrier having a plurality of plated through holes formed therein;
- a plurality of pins, each pin being soldered into a respective one of the plurality of plated through holes;
- a plurality of lands offset from the through holes;
- a metalized trace connecting each land to a plated through hole;
- and
- a plurality of solder balls attached to the lands.
3 more elements
Dependencies are inferred from the claim text.