Semiconductor package having downset leadframe for reducing package bow

A method for fabricating a semiconductor package comprising:

• providing a semiconductor die comprising a face and a plurality of bond pads on the face;
• providing a leadframe segment comprising a plurality of lead fingers, and a pair of opposing volume equalizing member downset from a first plane proximate to the face to a second plane proximate to a center line of the package;
• providing a semiconductor die;
• attaching the die to the lead fingers;
• wire bonding the die to the lead fingers;
• and
• molding a package body on the leadframe segment and on the die, the package body comprising substantially equal volumes of molding compound above and below the center line.

A method for fabricating a semiconductor package comprising:

• providing a semiconductor die comprising a face and opposing lateral edges;
• providing a leadframe segment comprising a plurality of lead fingers and opposing paddles downset from a plane of the lead fingers to a second plane;
• attaching the face to the lead fingers with the paddles located proximate to the lateral edges of the die;
• and
• molding a package body on the leadframe segment and on the die, the package body having a center line proximate to the second plane and comprising substantially equal volumes of molding compound above and below the center line.

A method for fabricating a semiconductor package comprising:

• providing a semiconductor die comprising a face and a plurality of bond pads on the face;
• providing a leadframe segment comprising a plurality of lead fingers and opposing volume equalizing members downset from a plane of the lead fingers to a second plane;
• wire bonding the bond pads to the lead fingers with the paddles located proximate to the lateral edges of the die;
• and
• molding a molding compound on the leadframe segment and on the die to form a package body, with the opposing volume equalizing members rigidifying the package body and occupying a space selected to substantially equalize a volume of the molding compound on either side of the leadframe segment.