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US 6,258,612 B1Granted
Determination of flux prior to package assembly
AssigneeAdvanced Micro Devices, Inc.
InventorsRaj N. Master, Jonathan D. Halderman
Life of this patent
Estimating the term…
Abstract
A package assembly is formed by applying flux to a device and/or a substrate and inspecting the applied flux to determine whether the amount applied is within a predetermined range. Embodiments include applying a rosin based flux on a laminate substrate and measuring the thickness of the applied flux with an interferometer.
Claims13
A method of monitoring flux application, the method comprising:
- applying flux to a substrate or a die to form a flux film having a thickness;
- and
- monitoring the thickness of applied flux.
A method of manufacturing an interconnected device assembly, the method comprising:
- providing a substrate having conductive contacts thereon for mounting a device, providing a device having a plurality of solder contacts thereon;
- applying a film of flux to the substrate and/or the device;
- monitoring the thickness of the applied flux;
- mounting the device on the substrate such that the solder contacts of the device are aligned with the conductive contacts on the substrate to form a substrate/device assembly;
- and
- forming an electrical connection between the solder contacts of the device and the conductive contacts on the substrate.
3 more elements
Dependencies are inferred from the claim text.