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US 6,258,170 B1Granted
Vaporization and deposition apparatus
AssigneeApplied Materials, Inc.
InventorsSasson Somekh, Jun Zhao, Charles Dornfest, Talex Sajoto, Leonid Selyutin, Vincent Ku, Chris Wang, Frank Chang, Po Tang
Life of this patent
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Abstract
The invention relates to an apparatus and process for the vaporization of liquid precursors and deposition of a film on a suitable substrate. Particularly contemplated is an apparatus and process for the deposition of a metal-oxide film, such as a barium, strontium, titanium oxide (BST) film, on a silicon wafer to make integrated circuit capacitors useful in high capacity dynamic memory modules.
Claims47
A process chamber for depositing a film, comprising:
- a) a chamber body forming an enclosure having one or more temperature controlled surfaces;
- b) a lid movably mounted on the chamber body, the lid having a heated main body and an outer temperature controlled collar;
- c) a heated gas distribution assembly comprising a gas manifold connected to a gas distribution member, the gas manifold adapted to deliver one or more gases into the gas distribution member, and;
- d) an exhaust port connected to the chamber body, the exhaust port having a temperature controlled liner disposed therein.
1 more element
Dependencies are inferred from the claim text.