CMP products
AssigneeSaint-Gobain Industrial Ceramics, Inc.
InventorsAjay K. Garg, Brahmanandam V. Tanikella, William R. Delaney
Life of this patent
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Abstract
CMP processes and products employ aluminas comprising alpha alumina particles having a particle width of less than 50 nanometers and a surface area of at least 50 m2/gm.
Claims8
A CMP process which comprises polishing a substrate comprising a metal and a non-conductive material using an abrasive that comprises an alumina powder in which the alumina particles of the powder have a silica coating and in which the powder has a BET surface area of at least 50 m2/gm, an alumina content of at least 90% by weight said alumina having an alpha alumina content of at least 90% by weight and wherein at least 90% of the alumina particles have ultimate particle widths of not more than 50 nanometers with less than 10% having ultimate particle sizes greater than 100 nm.
A CMP slurry that comprises an alumina powder in which the alumina particles of the powder have a silica coating and in which the powder has a BET surface area of at least 50 m2/gm, an alumina content of at least 90% by weight said alumina having an alpha alumina content of at least 90% by weight and wherein at least 90% of the particles have ultimate particle widths of from 20 to 50 nanometers with less than 10% having ultimate particle sizes greater than 100 nm.
An engineered abrasive suitable for use in CMP applications comprising a working surface which comprises a plurality of shaped structures obtained by curing a dispersion of alumina abrasive particles in a curable resin wherein the alumina abrasive particles have a silica coating, a BET surface area of at least 50 m2/gm, an alumina content of at least 90% by weight said alumina having an alpha alumina content of at least 90% by weight and wherein at least 90% of the particles have ultimate particle widths of from 20 to 50 nanometers with less than 10% having ultimate particle sizes greater than 100 nm.
Dependencies are inferred from the claim text.