Process for working a preform made of an oxide single crystal, and a process for producing functional devices
AssigneeNGK Insulators, Ltd.
InventorsTakashi Yoshino, Kenji Kato, Minoru Imaeda
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Abstract
A process for dicing a preform made of an oxide single crystal into cut pieces each having a given shape, includes the steps of removing molecules of the oxide single crystal through dissociation and evaporation with an optochemical reaction under irradiation of a laser beam upon the preform, thereby forming grooves on the preform, and then cleaving the preform along the groove.
Claims15
A process for dicing a preform made of an oxide single crystal into cut pieces each having a given shape, said process consisting essentially of the steps of removing molecules of the oxide single crystal through dissociation and evaporation with an optochemical reaction under iation of a single-wavelength laser beam upon the preform, thereby forming grooves on the preform, said laser beam having a wavelength near that of an absorption edge of the oxidesingle crystal, and then cleaving the preform along the grooves.
A process for producing functional devices provided on cut pieces each made of an oxide single crystal and having a given shape, said process consisting essentially of the steps of forming the functional devices on a wafer at positions corresponding to locations of the cut pieces, removing molecules of the oxide single crystal through dissociation and evaporation with an optochemical reaction under irradiation of a single-wavelength laser beam upon the wafer, thereby forming such grooves in the wafer as to surround the respective functional devices, said laser beam having a wavelength near that of an absorption edge of the oxide single crystal and then cleaving, the wafer along the grooves.
Dependencies are inferred from the claim text.