Integrated manufacturing solutions

An automated method of assembling a semiconductor device, comprising the steps of:

• generating a database comprising a table of assembly data references for a semiconductor device including marking reference, backgrind reference, bonding diagram reference, and wafer fab structure reference linked to a plurality of data files representing corresponding data elements;
• transmitting the database and linked data files to an assembly facility;
• and
• loading the data files to corresponding assembly machines to program corresponding assembly machines to assemble a semiconductor device according to the data references.

A computer memory storing instructions for programming a plurality of computer-controlled semiconductor assembly machines, the computer memory comprising:

• a first memory portion comprising a table of assembly specification data references for a semiconductor device;
• and
• second memory portions including a plurality of data references corresponding to entries in the table of the first memory portion, each of said plurality of data references comprising a specification for an assembly operation of a semiconductor device;
• wherein the table of the first memory portion is linked to corresponding second memory portions such that a user examining the table of the first memory portion may link to a corresponding second memory portion,
• wherein said table of assembly specification data references in said first memory portion includes a marking reference, backgrind reference, bonding diagram reference, and wafer fab structure reference, each linked to a corresponding second memory portion representing corresponding data elements.