Direct skew control and interlock of gantry
AssigneeSilicon Valley Group, Inc.
InventorsRexford Abbott, Son Phi
Life of this patent
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Abstract
Systems and methods are described for direct skew control and interlock of a gantry. An apparatus includes a gantry that includes a first member defining a gantry primary axis Z, a cross member defining a secondary axis X that is coupled to the first member via a trunnion, and a second member defining a gantry primary axis Z′ coupled to the cross member via an elastic hinge. A method for controlling skew on a cross member moved by a first and second driver includes moving the first and second drivers to a first position, measuring a resulting skew value, and correcting the skew on the cross member by moving the first driver and/or the second driver.
Claims46
An apparatus for positioning a wafer fabrication robot, the apparatus composing:
- a first member defining a primary axis Z, and a second member defining a primary axis Z′;
- a cross member defining a secondary axis X, the cross member being moveably coupled to the first member via a trunnion, and the cross member being moveably coupled to the second member via an elastic hinge;
- and
- a first driver slidably coupled to the first member and to a first end of the cross member to move the cross member along the primary axis Z;
- second driver slidably coupled to the second member and to a second end of the cross member to move the cross member along the primary axis Z′;
- a carriage for carrying the wafer fabrication robot, the carriage being slidably coupled to the cross member to move along the secondary axis X;
- and
- a control unit that detects a skew affecting the wafer fabrication robot and adjusts a position of at least the first driver or the second driver to compensate for the skew.
An apparatus for positioning a wafer fabrication robot, the apparatus comprising:
- a first member defining a gantry primary axis Z;
- a cross member defining a secondary axis X coupled to said first member via a trunnion;
- a second member defining a gantry primary axis Z′ coupled to said cross member via an elastic hinge;
- a sensor engaged with the trunnion to detect the skew on the cross member;
- a bracket slidably coupled to the first member;
- a first driver coupled to position the bracket along the first member;
- and
- wherein the sensor includes a ferrite core secured to a bottom segment of the trunnion, the bottom segment being secured to a support ledge of the bracket extending below the cross member, and wherein the sensor includes a coil secured to the cross member and aligned to receive an extension of the ferrite core once the cross member becoming skewed.
An apparatus for positioning a wafer fabrication robot, the apparatus comprising:
- a first member defining a primary axis Z, and a second member defining a primary axis Z′;
- a cross member defining a secondary axis X, the cross member being moveably coupled to the first member and to the second member, the cross member being pivotally coupled to the first member to be pivotal in a first direction and in a second direction along the first primary axis Z;
- and
- a carriage slidably coupled to the cross member for carrying the wafer fabrication robot;
- wherein said cross member includes a sensor adapted to measure a dimension representing skew of said cross member affecting the wafer fabrication robot.
An apparatus for positioning a wafer fabrication robot, the apparatus comprising:
- a first member defining a primary axis Z, and a second member defining a primary axis Z′;
- a cross member defining a secondary axis X moveably coupled to said first member via a trunnion and moveable coupled to said second member to move along the primary axis Z and the primary axis Z′;
- a carriage slidably coupled to the cross member for carrying the wafer fabrication robot along the secondary axis Z;
- and
- a mechanical fuse coupled to said cross member and adapted to detect excessive skew of said cross member.
A method for controlling skew on a cross member of a gantry moved by a first and second driver, the gantry being used to position a wafer fabrication robot that is slidably coupled to the cross member, the method comprising:
- moving the first and second drivers until the first driver is detected to be at a first position for engaging the wafer fabrication robot;
- measuring a resulting skew value affecting the wafer fabrication robot;
- and
- correcting the skew on the cross member by moving the second driver.
A method of controlling skew on a cross member of a gantry being used for positioning a wafer manufacturing robot, the gantry being moved by a first and second driver, the method comprising:
- a) performing a homing sequence to determine a home position for the first driver, and aligning the second driver to be substantially parallel with the first driver;
- then
- b) moving the first and second drivers to a first position;
- then
- c) measuring a resulting skew value using a skew sensor positioned within a trunnion;
- and then
- d) correcting the skew on the cross member by moving at least one of the first drivers and the second driver.
An apparatus for positioning wafer fabrication robot, the apparatus comprising:
- a first member defining a gantry primary axis Z;
- a second member defining a gantry primary axis Z′ coupled to the cross member,
- a cross member defining a secondary axis X coupled to the first member;
- a bracket slidably couples to the first member and including a support ledge that extends below the cross member,
- a trunnion that couples the cross member to the first member, the trunnion being adapted to pivot when the cross member is skewed;
- and
- a sensor provided on the cross member to measure a dimension representing skew of the cross member, the sensor including a ferrite core secured to a bottom segment of the trunnion, the bottom segment being secured to a support ledge of the bracket extending below the cross member, the sensor including a coil secured to the cross member and aligned to receive the ferrite core upon the cross member becoming skewed.
Dependencies are inferred from the claim text.