Interposer for semiconductor components having contact balls

In a test system for testing a semiconductor component having contact balls in a first ball grid array and including a socket having a plurality of contacts configured to electrically engage the contact balls, an interposer constructed to configure the socket for testing different components having contact balls in different arrays, the interposer comprising:

• a base comprising a plurality of external contact balls in a second ball grid array configured for mating electrical engagement with the contacts on the socket;
• an interconnect on the base comprising a plurality of interconnect contacts in electrical communication with the external contact balls on the base and configured to form temporary electrical connections with the contact balls on the component;
• and
• an alignment member on the base configured to align the component to the interconnect;
• the interposer interchangeable with a second interposer substantially similar thereto but adapted to configure the interposer and the socket for electrically engaging a different component having a plurality of second contact balls in a different ball grid array.

In a test system for testing semiconductor components including a test socket having contacts for electrically engaging a semiconductor component having contact balls in a first ball grid array, an interposer constructed to configure the test socket for testing different types of semiconductor components with different ball grid arrays comprising:

• a base comprising a plurality of external contacts comprising balls in a second ball grid array with a larger pitch than the first ball grid array configured for mating electrical engagement with the contacts on the test socket;
• an interconnect on the base comprising a plurality of interconnect contacts in electrical communication with the external contacts on the base and configured to electrically engage the contact balls on the component;
• and
• an alignment member on the base configured to align the component to the interconnect.

An interposer constructed to configure a test socket having a plurality of contacts in a first grid array for testing a semiconductor component having a plurality of contact balls in a second grid array comprising:

• a base configured for mounting to the test socket, the base comprising a plurality of external contacts comprising balls configured for electrical engagement with the contacts on the test socket and a plurality of fan out conductors in electrical communication with the external contacts;
• an interconnect on the base comprising a plurality of interconnect contacts in the second grid array, the interconnect contacts in electrical communication with the conductors on the base and configured to form temporary electrical connections with the contact balls on the component;
• and
• an alignment member on the base configured to align the component to the interconnect;
• the interposer configured for use with a second interposer constructed to configure the socket for electrical communication with a second component having a plurality of second contact balls in a third grid array.

An interposer for constructing electronic assemblies that include a substrate having a plurality of contacts and a semiconductor component having contact balls in a first grid array comprising:

• a base comprising a plurality of external contacts comprising balls in a second grid array bonded to the contacts on the substrate;
• and
• an interconnect on the base comprising a plurality of second contacts in the first grid array, the second contacts in electrical communication with the external contacts on the base and configured to electrically engage the contact balls on the component;
• the base and the interconnect configuring the substrate for electrical communication with the contact balls on the component,
• the interposer interchangeable with a second interposer substantially similar thereto but adapted to configure the substrate for electrical communication with a second component having a plurality of second contact balls in a grid array different than the first grid array.

An interposer for constructing electronic assemblies that include a substrate having a plurality of contacts and a semiconductor component having a plurality of contact balls comprising:

• a base comprising a plurality of external contacts comprising balls in a first ball grid array bonded to the contacts on the substrate;
• an interconnect on the base comprising a plurality of second contact balls in a second ball grid array with a smaller pitch than the first ball grid array, in electrical communication with the external contacts on the base and configured to form electrical connections with the contact balls on the component;
• and
• an alignment member on the base for aligning the component to the interconnect;
• the base, the interconnect and the alignment member configuring the substrate for electrically engaging the component,
• the interposer interchangeable with a second interposer substantially similar thereto but adapted to configure the interposer and the substrate for electrically engaging a second component having a plurality of second contact balls in a third ball grid array.