Sealable stagnation flow geometries for the uniform deposition of materials and heat
AssigneeSandia Corporation
InventorsKevin F. McCarty, Robert J. Kee, Andrew E. Lutz, Ellen Meeks
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Abstract
The present invention employs a constrained stagnation flow geometry apparatus to achieve the uniform deposition of materials or heat. The present invention maximizes uniform fluxes of reactant gases to flat surfaces while minimizing the use of reagents and finite dimension edge effects. This results, among other things, in large area continuous films that are uniform in thickness, composition and structure which is important in chemical vapor deposition processes such as would be used for the fabrication of semiconductors.
Claims12
A method for minimizing the consumption of reactant species in a gas deposition process, comprising the steps of:
- a.) causing a reactant gas to flow into a gas reactor about a central axis of a gas inlet, creating a flow directed substantially perpendicular to a substrate planar surface such that a stable axisymmetric staganation gas flow is established radially across and generally parallel with said planar surface, said reactant gas entering said inlet having a substantially uniform and radially invariant temperature, velocity and composition, and axisymmetric stagnation gas flow delivering a radially uniform material flux to said planar surface;
- b.) maintaining said substrate at a substantially uniform temperature;
- c.) constraining said axisymmetric stagnation gas flow to within a critical radius as said reactant gas exits said gas inlet thereby providing a constrained axisymmetric stagnation gas flow, said constrained gas flow bounded by a boundary streamline at said critical radius;
- d.) placing said substrate at a fixed distance from said gas inlet such that a reaction zone is established proximal to, and parallel with, said planar surface, said reaction zone extending radially outward to said boundary streamline;
- and
- e.) adjusting said critical radius such that said boundary streamline intercepts an edge of said substrate planar surface thereby establishing a maximum deposition area while minimizing consumption of said reactant gas during said gas deposition process.
Dependencies are inferred from the claim text.