Automatic defect detection and generation of control code for subsequent defect repair on an assembly line

A method for manufacturing an electronic device, the method comprising:

• placing a plurality of components on a printed wiring board (204, 206);
• detecting a defect in a component and, in response, producing a defect indication including a defect location on the printed wiring board (210);
• subsequently, placing additional components on the printed wiring board (220);
• and
• suspending placement of any additional components when a common area of the printed wiring board covered by both the defect location and the any additional components (220).

A method for manufacturing an electronic device, the method comprising:

• (a) placing a first plurality of components on a printed wiring board (PWB) (204, 206);
• (b) identifying at least one defect in component placement (210);
• (c) determining location of the at least one defect;
• (d) comparing the location of the at least one defect with locations of components to be subsequently placed on the PWB (214);
• (e) when the location of the at least one defect matches a location of a component to be subsequently placed, suspending placement of the component to be subsequently placed (220);
• (f) placing additional components having locations not matching the location of the component to be subsequently placed;
• (g) in response to comparing (d), generating code for controlling a machine which places the component to be subsequently placed on the PWB (216);
• and
• (h) conveying the code to the machine (218).

A manufacturing method for an assembly line (100) including a plurality of manufacturing stations under control of a process controller (128), the method comprising:

• at a first manufacturing station, placing (204) first components on a printed wiring board (PWB) under control of the process controller;
• at a second manufacturing station, automatically inspecting (208) the PWB under control of the process controller to identify defects in placement of the first components;
• if a defect is identified, storing at the process controller a location of the defect;
• at a third manufacturing station which is operable in response to program code stored at the third manufacturing station, placing additional components on the PWB, including
• determining a location of a component to be placed,
• comparing the location of the component to be placed with the location of the defect,
• determining if the component to be subsequently placed will interfere with the defect (214),
• if the component to be subsequently placed will interfere, at the process controller, generating (216) new program code for the third manufacturing station to control placement of additional components on the PWB,
• forwarding (218) the new program code to the third manufacturing station;
• under control of the new program code, placing (220) the additional components on the PWB making exceptions for the component to be subsequently placed which will interfere with the defect.