Method and apparatus for forming a plastic chip on chip package module
AssigneeNational Semiconductor Corporation
InventorsLuu Nguyen, Ashok Prabhu, Nikhil Kelkar, Hem P. Takiar
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Abstract
A method and an apparatus for forming a plastic chip on chip module is disclosed. The plastic chip on chip module is formed by placing a stacked chip set into a molding chamber suitably arranged to receive encapsulant. The stacked chip set includes a daughter chip that is electrically and mechanically coupled to a mother chip where the daughter chip is directly aligned to and separated from the mother chip by a standoff gap. Encapsulant is then passed into the molding chamber filling the standoff gap substantially simultaneously with surrounding the chip set to form the plastic chip on chip module.
Claims15
A method of forming a plastic chip on chip package wherein the plastic chip on chip package includes a stacked chip set that includes a daughter chip that is electrically and mechanically coupled to a mother chip, wherein the daughter chip is directly aligned to and separated from the mother chip by a standoff gap, the method comprising:
- placing the stacked chip set into a molding chamber suitably arranged to receive an encapsulant;
- passing the encapsulant into the molding chamber;
- and
- filling the standoff gap while substantially simultaneously surrounding the chip set with the encapsulant thereby substantially encapsulating the daughter chip and the mother chip within the molding chamber by the encapsulant;
- and
- curing the encapsulant to form the plastic chip on chip package.
A method of forming a plastic chip on chip package wherein the plastic chip on chip package includes a stacked chip set that includes a daughter chip that is electrically and mechanically coupled to a mother chip, wherein the daughter chip is directly aligned to and separated from the mother chip by a standoff gap, comprising:
- filling the standoff gap while substantially simultaneously surrounding the chip set with encapsulant thereby substantially encapsulating the daughter chip and the mother chip by the encapsulant;
- and
- curing the encapsulant to form the plastic chip on chip package.
Dependencies are inferred from the claim text.