Cooling module including a pressure relief mechanism
AssigneeMotorola, Inc.
InventorsMorris B. Bowers, Kevin J. McDunn
Life of this patent
Estimating the term…
Abstract
The present invention provides a cooling module (100) and a method for forming the cooling module (100). The cooling module (100) is effective in reducing the temperature of heat-generating components mounted on the cooling module (100). The cooling module (100) includes a housing (105), a pressure relief mechanism (200), and a shearing surface (201). The housing (105) includes a cooling material (121) disposed therein. The pressure relief mechanism (200) is disposed within the housing (105) and covers the opening (203) to provide a seal that seals the housing (105). The shearing surface (201) is effective to break the seal upon exceeding a predetermined pressure within the housing (105).
Claims2
A cooling module for reducing the temperature of heat-generating components, the cooling module comprising:
- a housing having a cooling material disposed therein, the housing including a first surface including an inner face, an outer face, and an opening extending from the inner face to the outer face and a second surface opposite the first surface;
- a pressure relief mechanism disposed within the housing and covering the opening to provide a seal that seals the housing, the pressure relief mechanism formed of a boss disposed within the housing, the boss including a generally circular central portion and a trench formed about the generally circular central portion;
- wherein the second surface includes a depression sized and shaped to receive the boss;
- and
- a shearing surface that is effective to break the seal upon exceeding a predetermined pressure within the housing.
Dependencies are inferred from the claim text.