Temperature compensated microelectromechanical structures and related methods

A temperature compensated microelectromechanical structure, comprising:

• a microelectronic substrate having a first major surface;
• a frame, disposed upon the first major surface of said microelectronic substrate and that is configured to move in response to a change in ambient temperature;
• and
• an active microactuator, disposed upon the first major surface of said microelectronic substrate, said active microactuator being operably connected to said frame and that is configured to move relative to said frame to maintain a position of the active microactuator relative to the microelectronic substrate in response to the change in ambient temperature.

A temperature compensated microelectromechanical structure comprising:

• a microelectronic substrate having a first major surface;
• a frame, disposed upon the first major surface of said microelectronic substrate and that is configured to move in a first direction in response to a change in ambient temperature, wherein said frame further comprises at least one anchor affixed to the first major surface of the microelectronic substrate;
• and
• an active microactuator, disposed upon the first major surface of said microelectronic substrate, said active microactuator being operably connected to said frame and that is configured to move in a second direction that is different than the first direction to maintain a position of the active microactuator relative to the microelectronic substrate in response to the change in ambient temperature, wherein said frame has a generally concave shape adapted to receive and support said active microactuator, and wherein said active microactuator is disposed within said frame.

A temperature compensated microelectromechanical structure comprising:

• a microelectronic substrate having a first major surface;
• a frame, disposed upon the first major surface of said microelectronic substrate and that is configured to move in a first direction in response to a change in ambient temperature, wherein said frame further comprises at least one anchor affixed to the first major surface of the microelectronic substrate;
• and
• an active microactuator, disposed upon the first major surface of said microelectronic substrate, said active microactuator being operably connected to said frame and that is configured to move in a second direction that is different than the first direction to maintain a position of the active microactuator relative to the microelectronic substrate in response to the change in ambient temperature, wherein said active microactuator is disposed within said frame, and wherein said frame has a generally closed shape to substantially surround said active microactuator therein.

A temperature compensated microelectromechanical structure comprising:

• a microelectronic substrate having a first major surface;
• a frame, disposed upon the first major surface of said microelectronic substrate and that is configured to move in a first direction in response to a change in ambient temperature;
• and
• an active microactuator, disposed upon the first major surface of said microelectronic substrate, said active microactuator being operably connected to said frame and that is configured to move in a second direction that is different than the first direction to maintain a position of the active microactuator relative to the microelectronic substrate in response to the change in ambient temperature, further comprising at least two electrical contacts disposed upon said microelectronic substrate, said at least two electrical contacts being separated such that said at least two electrical contacts are electrically disconnected, wherein said active microactuator further comprises at least one shorting electrical contact, and wherein said active microactuator is controllably moved in response to active alteration of the temperature thereof, such that said at least one shorting electrical contact selectively electrically connects said at least two electrical contacts.

A temperature compensated microelectromechanical structure comprising:

• a microelectronic substrate having a first major surface;
• a frame, disposed upon the first major surface of said microelectronic substrate and that is configured to move in a first direction in response to a change in ambient temperature;
• and
• an active microactuator, disposed upon the first major surface of said microelectronic substrate, said active microactuator being operably connected to said frame and that is configured to move in a second direction that is different than the first direction to maintain a position of the active microactuator relative to the microelectronic substrate in response to the change in ambient temperature, the structure further comprising:
• a valve member disposed upon said microelectronic substrate, wherein said valve member defines a passage therethrough, and wherein said active microactuator is adapted to selectively block at least a portion of said passage in response to active alteration of the temperature thereof.

A temperature compensated microelectromechanical structure comprising:

• a microelectronic substrate having a first major surface;
• a frame, disposed upon the first major surface of said microelectronic substrate and that is configured to move in a first direction in response to a change in ambient temperature;
• and
• an active microactuator, disposed upon the first major surface of said microelectronic substrate, said active microactuator being operably connected to said frame and that is configured to move in a second direction that is different than the first direction to maintain a position of the active microactuator relative to the microelectronic substrate in response to the change in ambient temperature, wherein said active microactuator further comprises a mirror adapted for movement with said microactuator, wherein the relative position of said mirror with respect to said microelectronic substrate is substantially maintained over a range of ambient temperatures in the absence of active alteration of the temperature of said microactuator, and wherein the relative position is modified in response to active alteration of the temperature of said active microactuator.

A temperature compensated microelectromechanical structure comprising:

• a microelectronic substrate having a first major surface;
• a frame, disposed upon the first major surface of said microelectronic substrate and that is configured to move in a first direction in response to a change in ambient temperature;
• and
• an active microactuator, disposed upon the first major surface of said microelectronic substrate, said active microactuator being operably connected to said frame and that is configured to move in a second direction that is different than the first direction to maintain a position of the active microactuator relative to the microelectronic substrate in response to the change in ambient temperature, wherein said active microactuator further comprises an attenuator of electromagnetic radiation, said attenuator adapted for movement with said active microactuator so as to selectively block electromagnetic radiation traveling along at least one path, wherein the relative position of said attenuator with respect to the path of electromagnetic radiation is substantially maintained over a range of ambient temperatures in the absence of active alteration of the temperature of said active microactuator, and wherein the relative positions are modified in response to active alteration the temperature of said microactuator.