Hot melt adhesive composition containing α-olefin/aromatic vinyl compound random copolymer
AssigneeMitsui Chemicals, Inc.
InventorsKenichi Morizono, Keiji Okada, Suguru Tokita
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AssigneeMitsui Chemicals, Inc.
InventorsKenichi Morizono, Keiji Okada, Suguru Tokita
Estimating the term…
A hot melt adhesive composition exhibiting excellent adhesive strength and which is useful as an adhesive for styrene resins contains (B) tackifier and (C) ethylene/C3-C20 α-olefin/aromatic vinyl compound random copolymer and, in some embodiments also (A) base polymer, such as polyolefin, polar group-containing polymer and aromatic vinyl compound/conjugated diene copolymer. A low molecular weight polyolefin may also be included in all embodiments. The randon copolymer (C) may be prepared by polymerizing the α-olefin and aromatic vinyl compound in the presence of a metallocene containing catalyst. In addition to excellent adhesive strength the hot melt adhesives have improved workability.
A hot melt adhesive composition comprising:
A hot melt adhesive composition comprising:
A hot melt adhesive composition comprising:
Dependencies are inferred from the claim text.