Fanless cooling system for computer
OwnerKioan Cheoninventor
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OwnerKioan Cheoninventor
Estimating the term…
A computer (2) has a plurality of heat-producing components, including a microprocessor chip (10). A heat transfer device (22) through which a liquid coolant (C) is circulated is mounted in heat exchanging contact on the component (10). The device (22) may be mounted directly or via a Peltier thermoelectric cooler (14) positioned between the component (10) and the device (22). Coolant (C) from the device (22) is circulated to and through a reservoir (42) mounted on an inner mounting surface (38) of a radiator (34). The radiator (34) has heat dissipating fins (40) exposed to ambient air. The power supply (6) of the computer (2) is mounted directly on the mounting surface (38) so that heat produced by the power supply (6) will be dissipated by the radiator (34). Preferably, a plurality of transistors (66) of the power supply (6) are mounted on the mounting surface (38) separately from the mounting board (64) of the power supply 6).
A cooling system for a computer having a housing, a power supply, and at least one heat-producing component mounted inside the housing, comprising:
A cooling system for a computer having a housing, a power supply, and at least one heat-producing component mounted inside the housing, comprising:
Dependencies are inferred from the claim text.