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US 6,229,114 B1Granted
Precision laser cutting of adhesive members
AssigneeXerox Corporation
InventorsJohn R. Andrews, Brian S. Hilton, Steven R. Moore, Roy A. Trowbridge, Jr., Gary D. Redding, William G. Hawkins, C. Glenn Prince
Life of this patent
Estimating the term…
Abstract
A process for precision patterning or cutting of a sheet stock, such as an adhesive tape, includes the step of irradiating a surface of a sheet stock with an irradiation source to pattern or cut a part in the sheet stock. The method is particularly useful for precision cutting adhesive members, such as adhesive fluid seals, for an inkjet print cartridge.
Claims30
A process for precision patterning of a sheet stock, comprising:
- irradiating a surface of a sheet stock with an irradiation source to pattern a part in said sheet stock, and cutting to at least one controlled depth in said sheet stock with said irradiation source,
- wherein said part has cut features separated by 500 μm or less and having less than 25% of a separation distance between the cut features perturbed by the cutting process.
A process for precision cutting a discrete part from a sheet stock, comprising:
- irradiating a surface of a sheet stock with a laser source to cut a discrete part from said sheet stock,
- wherein said discrete part has cut features separated by 500 μm or less and having less than 25% of a separation distance between the cut features perturbed by the cutting process.
Dependencies are inferred from the claim text.