Method of forming a flexible laminate for flexible circuit
AssigneeGA-TEK Inc. (dba Gould Electronics Inc.)
InventorsMichael A. Centanni, Mark Kusner
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Abstract
Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.
Claims13
A method of forming a flexible circuit laminate for use in the production of electronic circuits, comprising the steps of:
- depositing a continuous layer of copper on a first side of a generally continuous strip of polyimide film having at least one layer of metal on said first side;
- modifying a second side of said polyimide strip to increase the surface energy thereof by depositing a thin layer of a tiecoat metal thereon;
- applying a dimensionally stable adhesive onto said tiecoat metal, said adhesive being formed of an uncured, polymeric material, said polymeric material having properties wherein it will not significantly flow under a staking pressure exerted along its planar surface;
- and
- curing said adhesive wherein at least an outermost region of said adhesive strip is only partially cured.
Dependencies are inferred from the claim text.