High speed jet soldering system

A jetting system for dispensing drops of material along an ejection axis onto a substrate, the system comprising:

• an ejector from which a stream of the material is ejected
• a deflection device;
• and
• a control system;
• said ejector including a chamber containing the material to be dispensed, a vibration device, an orifice defining structure, and a charging device;
• said vibration device providing disturbances in the stream of material to cause the stream to be fractured into drops
• said orifice-defining structure defining an orifice which the material is ejected;
• said charging device being positioned below said orifice to receive the drops of material and apply an electric charge to the drops;
• said deflection device receiving drops from said charging device to deflect said drops in a predetermined manner;
• said control system including an alignment system and a gimbal system and communicating with said deflection device and said ejector to calibrate and control the deflection device and the ejector
• said alignment system having at least one monitoring device and at least one control device to monitor position of said drops of material and control the position of the drops by adjusting said ejector and said gimbal system;
• said gimbal system being connected to said ejector and having at least one moveable section including at least one motor for adjusting position of said ejector.