Slurry composition for polishing a glass ceramic substrate
AssigneeKomag, Inc.
InventorAndrew M. Homola
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Abstract
A slurry in accordance with the invention comprises CeO2 polishing particles and sodium polyacrylate in an aqueous solution. This slurry is used to polish a glass or glass ceramic substrate. I have discovered that adding sodium polyacrylate to a CeO2 slurry improves the polishing rate without causing a major negative impact on the slurry stability or redispersibility. In addition, the addition of the sodium polyacrylate does not cause a great deal of foaming. This polishing process can be used to prepare substrates for the manufacture of magnetic disks.
Claims17
A method for polishing a silica-containing substrate, said substrate having a surface, said method comprising:
- applying a polishing pad against the surface of said substrate;
- introducing a slurry between said polishing pad and said surface, said slurry comprising polishing particles and a polyacrylate in an aqueous solution;
- and
- depositing a magnetic film on said substrate after said step of polishing said substrate.
A method for polishing a silica substrate, said substrate having a surface, said method comprising:
- applying a polishing pad against the surface of said substrate;
- introducing a slurry between said polishing pad and said surface, said slurry comprising polishing particles and a polyacrylate in an aqueous solution;
- and
- depositing a magnetic film on said substrate after said step of polishing said substrate.
A method for polishing a silica-containing substrate, said substrate having a surface, said method comprising:
- applying a polishing pad against the surface of said substrate;
- introducing a slurry between said polishing pad and said surface, said slurry comprising polishing particles and a polyacrylate in a solution;
- and
- depositing a magnetic film on said substrate after said step of polishing said substrate.
Dependencies are inferred from the claim text.