Planarization of non-planar surfaces in device fabrication
AssigneeMicron Technology, Inc.
InventorEugene P. Marsh
Life of this patent
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Abstract
A method of planarizing a surface of a wafer includes providing a planarization material on the wafer surface and bringing a substantially flat surface into contact with the planarization material on the wafer. The planarization material is exposed to radiation at a first wavelength to cure the planarization material and is exposed to radiation at a second wavelength to cause changes to the planarization material that facilitate separation of the substantially flat surface from the planarization material.
Claims26
A method of planarizing a surface of a wafer, the method comprising:
- providing a planarization material on the wafer surface;
- bringing a substantially flat surface into contact with the planarization material on the wafer surface;
- exposing the planarization material to radiation at a first wavelength to cure the planarization material;
- and
- exposing the planarization material to radiation at a second wavelength to cause changes to the planarization material that facilitate separation of the substantially flat surface from the planarization material.
A method of planarizing a surface of a wafer, the method comprising:
- providing a planarization material on the wafer surface, wherein the planarization material includes a first acid-generating agent sensitive to radiation at a first wavelength and a second base-generating agent sensitive to radiation at a second wavelength, wherein the planarization material is cured in the presence of acid;
- bringing a substantially flat surface into contact with the planarization material on the wafer;
- exposing the planarization material to radiation at the second wavelength to produce base near an interface between the planarization material and the substantially flat surface;
- and
- exposing the planarization material to radiation at the first wavelength to produce acid in the planarization material.
Dependencies are inferred from the claim text.