Back to results
US 6,217,671 B1Granted
Composition for increasing activity of a no-clean flux
AssigneeInternational Business Machines Corporation
InventorsDonald W. Henderson, James Spalik
Life of this patent
Estimating the term…
Abstract
An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.
Claims15
A no-clean flux composition for use in soldering, consisting essentially of:
- a dicarboxylic acid;
- an organic solvent;
- and
- acetic acid in a concentration in the range of from about 2% to about 4% by weight.
1 more element
A no-clean flux composition comprising:
- a dicarboxylic acid;
- an organic solvent;
- and acetic acid, wherein the dicarboxylic acid comprises about 4.5% by weight of the composition, and the acetic acid comprises about 2% by weight of the composition.
A no-clean flux composition comprising:
- a dicarboxylic acid;
- an organic solvent;
- and acetic acid in a concentration in a range of from about 2% to about 4% by weight, wherein the organic solvent comprises a first organic solvent selected from the group consisting of isopropanol, n-propanol and benzyl alcohol, and a second organic solvent selected from the group consisting of propylene glycol monobutyl ether, propylene glycol monopropyl ether, and diethylene glycol monomethyl ether.
Dependencies are inferred from the claim text.