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US 6,212,086 B1Granted
Packaging of a DC-to-DC converter
AssigneeIntel Corporation
InventorJames S. Dinh
Life of this patent
Estimating the term…
Abstract
Briefly, in accordance with one embodiment of the invention, a DC-to-DC converter package includes: a DC-to-DC converter circuit. The components of the DC-to-DC converter circuit that perform high frequency switching during converter operation are surface mounted on a printed circuit board (PCB) so that the heat produced from the high frequency switching is approximately equally distributed at least over the portion of the PCB where the components are mounted.
Claims15
A DC-to-DC converter package comprising:
- a DC-to-DC converter circuit;
- rectifier components of said DC-to-DC converter circuit that perform high frequency switching during converter operation being surface mounted on at least a portion of a printed circuit board (PCB) so that heat produced from said high frequency switching is approximately equally distributed at least over an area greater than the portion of the PCB where said components are mounted on It said PCB.
A system comprising:
- a processor and a DC-to-DC converter package;
- said DC-to-DC converter package including:
- a DC-to-DC converter circuit;
- the DC-to-DC converter circuit including one winding on the secondary of a transformer;
- the DC-to-DC converter circuit including an output inductor having one winding;
- and
- rectifier components of the DC-to-DC converter circuit that perform high-frequency switching during converter operation being surface mounted on at least a portion of a printed circuit board (PCB) so that heat produced from said high frequency switching is approximately equally distributed at least over an area greater than the portion of the PCB where said components are mounted on said PCB;
- wherein said DC-to-DC converter package has the capability to dissipate heat during DC-to-DC converter operation without a heat sink.
5 more elements
Dependencies are inferred from the claim text.