Enhanced heat-dissipating printed circuit board package

Abstract

A printed circuit board is provided comprising a substrate, a conductor on the surface of the substrate, and an electronic component mounted on the conductor. The printed circuit board includes a first thermally conductive layer within the substrate and a second thermally conductive layer on a portion of the surface of the substrate and spaced from the electronic component. The electronic component is thermally coupled to the second thermally conductive layer by a thermally conductive aperture positioned within the substrate and connected to the conductor and the first thermally conductive layer. The first thermally conductive layer is connected to the second thermally conductive layer by a plurality of apertures also positioned in the substrate. Another printed circuit board is also provided comprising a first plurality of laminate dielectric layers, a conductor on a surface of the first plurality of laminated dielectric layers, and an electronic component mounted on the conductor. The printed circuit board includes a second plurality of laminated dielectric layers connected to the first plurality of laminated dielectric layers by a flexible web. The flexible web includes a first thermally conductive layer positioned within the first plurality of dielectric layers. A thermally conductive aperture thermally connects the electronic component to the first thermally conductive layer. A plurality of thermally conductive apertures is positioned within the second plurality of dielectric layers and thermally couples the first thermally conductive layer to a second thermally conductive layer which is included on a portion of a surface of the second plurality of dielectric layers and spaced from the electronic component. The flexible web portion thus allows positioning of the second thermally conductive layer in a plane remote from the electronic component when it is positioned in a confined space.

Dependencies are inferred from the claim text.