Electronics package on a plate, and a method of making such a package
AssigneeSagem SA
InventorsXavier Boutin, Alain Dreyfus, Jean Hoche, Alain Prolonge
Life of this patent
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Abstract
An electronic package has a plate of aluminum or aluminum alloy supporting electronic microcomponents. Trenches, and possibly cavities, are formed on a major surface of the plate. An insulating oxide layer covers the major surface, including the trenches and cavities. A network of equipotential electrically conductive connection tracks are formed on the major surfaces and receive contacts of the electronic microcomponents. Some tracks are above the trenches and thicker than the others.
Claims9
An electronic package comprising:
- a plate of aluminum or aluminum alloy having trenches formed on a major surface thereof,
- an insulating oxide layer on at least the whole of said major surface of said plate,
- a network of equipotential electrically conductive connection tracks on said major surface arranged to receive electronic microcomponents, some at least of said tracks overlying said trenches, and
- a plurality of electronic microcomponents having contacts electrically connected to some at least of said tracks.
An electronic package comprising:
- a plate of unalloyed or alloyed aluminum, having recesses in the form of trenches or cavities formed on at least one major surface thereof and having an array of through holes,
- an oxide layer covering at least said major surface including said recesses and a surface of said holes,
- a network of equipotential electrically conductive connection tracks on said major surface;
- electronic microcomponents having contacts fixed to some of the tracks by soldering,
- some at least of said microcomponents or said tracks being in said recesses;
- and
- electrical connection pins passing through the plate, soldered to some at least of said tracks of the network and projecting from a major surface of said plate opposed to said major surface of the plate into electrical connection means fixed to the plate and arranged to receive a mating connector.
A method of manufacturing an electronics package comprising the steps of:
- making a plate of unalloyed or alloyed aluminum and forming trenches in a major surface thereof;
- forming an oxide layer on said major surface of the plate and onto said trenches and forming a network of equipotential connecting tracks on the plate, with at least some of the tracks overlying said trenches;
- and
- mounting electronic microcomponents on said oxidized major surface and soldering contacts of the microcomponents to some at least of the tracks.
Dependencies are inferred from the claim text.