Alignment device for an IC-mounted structure
AssigneeSeiko Epson Corporation
InventorShigetoshi Yamada
Life of this patent
Estimating the term…
Abstract
An alignment mark 4K is formed by a through hole in an opaque circuit substrate 1. An alignment mark 4I of an IC chip 3 is photographed by a CCD camera 9 through the alignment mark hole 4K, and the position of the IC chip 3 is adjusted so that the IC side alignment mark 4I is in the prescribed positional relationship to the substrate side alignment mark hole 4K. Then, the IC chip 3 is adhered to the circuit substrate 1 using the adhesive such as ACF 2, etc. Both alignment marks 4I and 4K can be simultaneously photographed by one photograph of the camera 9, and the alignment can be continuously performed.
Claims18
An IC mounting structure to mount an IC chip on an opaque circuit substrate, comprising:
- a substrate side alignment mark to be formed on said circuit substrate;
- and
- an IC side alignment mark to be formed on the IC chip and aligned to said substrate side alignment mark, wherein said substrate side alignment mark is a light-transmitting through hole in said circuit substrate.
An IC mounting structure for mounting an IC chip on an opaque circuit substrate comprising:
- a first alignment mark formed on said IC chip;
- and
- a second alignment mark formed on said opaque circuit substrate, said second alignment mark being a light-transmitting through hole formed in said opaque circuit substrate.
A method of mounting an IC chip on an opaque circuit substrate comprising:
- providing a first alignment mark on said IC chip;
- providing a second alignment mark on said opaque circuit substrate, said second alignment mark being light-transmitting;
- positioning said IC chip adjacent said opaque circuit substrate;
- observing said first alignment mark through said second alignment mark;
- adjusting a location of said IC chip relative to said opaque circuit substrate until said first alignment mark is in a prescribed position relative to said second alignment mark;
- and
- adhering said IC chip to said opaque circuit substrate.
A liquid crystal device comprising:
- a first transparent substrate;
- a second transparent substrate mounted opposite said first transparent substrate with a gap therebetween;
- a liquid crystal disposed within said gap;
- an opaque circuit substrate mounted to said first transparent substrate, said circuit substrate including a first alignment mark in the form of a light-transmitting through hole;
- and
- an IC chip mounted to said opaque circuit substrate, said IC chip including a second alignment mark aligned with said first alignment mark.
Dependencies are inferred from the claim text.