Dual-notch loaded microstrip antenna
AssigneeIndustrial Technology Research Institute
InventorSheng-Ming Deng
Life of this patent
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Abstract
A dual-notch loaded microstrip antenna has a single-medium substrate, a metal layer and a microstrip antenna layer, wherein the microstrip antenna layer of the microstrip antenna is etched into a double dual-notch or a single dual-notch structure. The microstrip antenna layer and the metal layer adhere respectively to opposite sides of the single-layer substrate, wherein the metal layer works as the electrical ground. The single-layer substrate contains a penetrating opening whose diameter and location are predetermined. The task of transmitting and receiving dual-band or multi-band signals is carried out by feeding the microstrip layer with signals from a connector, such as a coaxial connector, through the penetrating opening.
Claims12
A dual-notch loaded microstrip antenna comprising:
- a single-medium substrate;
- a metal layer attached to a bottom surface of the single-medium substrate, wherein the metal layer is electrically grounded;
- a microstrip layer attached to a top surface of the single-medium substrate, wherein the microstrip layer is shaped to include at least a dual-notch located at end portions, wherein a notch shape of the dual-notch is parallel to a rim shape of the microstrip layer at the end portions;
- and
- a penetrating opening through the single-medium substrate for feeding signals to the microstrip antenna from the metal layer.
A notched loaded microstrip antenna comprising:
- a single-medium substrate;
- a metal layer formed on a bottom surface of the single-medium substrate, wherein the metal layer is electrically grounded;
- a microstrip layer formed on a top surface of the single-medium substrate, wherein the microstrip layer is shaped to have two dual-notches symmetrical to each other at end portions of the microstrip layer. wherein a notch shape of the two dual-notch is parallel to a rim shape of the microstrip layer;
- and
- a penetrating opening through the single-medium substrate for feeding signals to the microstrip layer from the metal layer.
Dependencies are inferred from the claim text.