Semiconductor composite sensor
AssigneeHitachi, Ltd.
InventorsSusumu Murakami, Satoshi Shimada, Seiichi Ugai, Yukio Takahashi, Shuichi Shimizu
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Abstract
A semiconductor composite sensor using a plurality of semiconductor piezoresistive gauge elements connected in series. The piezoresistive elements are separated so that a high potential terminal of one of the resistive elements having the same resistance values and the substrate of the other of the resistive elements will be connected with equal potential values. Potential difference values between semiconductor regions serving as respective resistive elements and the substrates are made equal.
Claims6
A semiconductor composite sensor comprising:
- at least two detection regions, each detection region including:
- a sensor substrate having a first p-type semiconductor region and a first n-type semiconductor region formed on said first p-type semiconductor region;
- a piezo-resistive element having a second p-type semiconductor region formed in a part of said first n-type semiconductor region and having a resistance value which changes in accordance with a pressure applied thereto;
- an isolating means surrounding said piezo-resistive element formed to extend through said first n-type semiconductor region and communicate with said first p-type semiconductor region;
- the piezo-resistive elements in said detection regions being serially interconnected;
- and
- each piezo-resistive element having a first electrode adapted for connection to a higher potential and a second electrode adapted for connection to a lower potential, said first electrode also contacting said first n-type semiconductor region in its associated detection region.
A differential pressure transmitter comprising:
- a lower side pressure inlet port and a higher side pressure inlet port to which respectively lower and higher pressures are introduced;
- a composite sensor substrate including sensors to detect physical quantities including a differential pressure, a static pressure and a temperature;
- and
- a sealing diaphragm and a pressure transmission medium through which respectively introduced lower side and higher side pressures are transmitted to said composite sensor substrate,
- said composite sensor substrate comprising:
- at least two detection regions, each detection region including:
- a sensor substrate having a first p-type semiconductor region and a first n-type semiconductor region formed on said first p-type semiconductor region;
- a piezo-resistive element having a second p-type semiconductor region formed in a part of said first n-type semiconductor region and having a resistance value which changes in accordance with a pressure applied thereto;
- an isolating means surrounding said piezo-resistive element formed to extend through said first n-type semiconductor region and communicate with said first p-type semiconductor region;
- the piezo-resistive elements in said detection regions being serially interconnected;
- and
- each piezo-resistive element having a first electrode adapted for connection to a higher potential and a second electrode adapted for connection to a lower potential, said first electrode also contacting said first n-type semiconductor region in its associated detection region.
Dependencies are inferred from the claim text.