Apparatus for electrically testing bare printed circuits
AssigneeTessera, Inc.
InventorJoseph Fjelstad
Life of this patent
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Abstract
A testing fixture for microelectronic elements is in the nature of an interposer which is operative for receiving a plurality of test probes. The interposer enables the simultaneous testing of contacts on the microelectronic element which are arranged in both high contact pitch density areas and normal contact pitch density areas. The contacts on the microelectronic element within the high contact pitch density areas are accessed by conductive leads on the interposer having rigid portions arranged in a corresponding high contact pitch density.
Claims37
An interposer for testing a microelectronic element having a plurality of contacts, said interposer comprising a substrate having a top surface and a bottom surface, at least one conductive lead extending on said top surface between a first and second position, a first opening extending through said substrate from said bottom surface to a location on said top surface in communication with said conductive lead at said first position, said conductive lead at said second position registrable with one of said contacts on said microelectronic element, said opening adapted for removable insertion of a test probe therein for engagement with said conductive lead at said first position.
An interposer for testing a microelectronic element having a plurality of contacts, said interposer comprising a substrate having a top surface and a bottom surface, at least one conductive lead extending along one of said surfaces having a first end and a second end, a first layer overlying said bottom surface of said substrate having a first opening in alignment with said first end of said lead and a second opening spaced therefrom in alignment with an opening in said substrate extending between said top and bottom surfaces, said first opening operative for receiving a test probe therein for engagement with said first end of said lead for electrical connection to one of said contacts on said microelectronic element upon engagement therewith by said second end of said lead, said second opening operative for receiving a test probe therein for engagement with another one of said contacts on said microelectronic element.
An interposer for testing a microelectronic element having a plurality of contacts arranged in a first and second matrix having different pitch densities, said interposer comprising a substrate having a top surface and a bottom surface, a plurality of first openings extending through said substrate arranged in a matrix having a pitch density corresponding to the pitch density of said first matrix of said contacts, said first openings operative for receiving a plurality of test probes for engagement with a corresponding plurality of contacts on said microelectronic element, a plurality of conductive leads on one of said surfaces of said substrate, each said lead having a first end and a second end, said second ends of said leads arranged in a matrix having a pitch density greater than said pitch density of said plurality of contacts within said first matrix, said second ends of said leads operative for engagement with said contacts on said microelectronic element arranged in a matrix having a pitch density corresponding to said pitch density of said second matrix of said contacts, a rigid layer overlying said bottom surface of said substrate and having a plurality of second openings in alignment with said first ends of said leads, said second openings operative for receiving a plurality of test probes for engagement with said first ends of said leads for electrical connection to said contacts in said second matrix on said microelectronic element, said rigid layer including a plurality of third openings in alignment with said plurality of said first openings within said substrate, said third openings operative for receiving a plurality of test probes therein for engagement with said contacts in said first matrix on said microelectronic element.
Dependencies are inferred from the claim text.