Evaluation apparatus and fabrication system for semiconductor

A semiconductor fabrication system including a semiconductor fabrication apparatus, comprising:

• electric property measuring means for measuring the electric property of said semiconductor apparatus fabricated by said semiconductor fabrication apparatus;
• semiconductor evaluation apparatus for analyzing at least one of an impurity distribution and a surface shape of a measuring specimen, said electric property of which is determined to be out of order by said electric property measuring means;
• fabrication condition error detecting means for detecting a deviation between fabrication conditions extracted conversely based on a result analyzed by the semiconductor evaluation apparatus and fabrication conditions detected by the fabrication condition error detecting means, and
• fabrication condition changing means for changing the fabrication conditions for said semiconductor fabrication based on the deviation of the fabrication conditions detected by the fabrication condition error detect means, wherein:
• said semiconductor evaluation apparatus includes SCM measuring means for measuring the CV property showing the relationship between the capacitance C between the probe tip and the measuring specimen, and the voltage V supplied to the measuring specimen via the probe tip, probe shape adjusting means for adjusting the shape data of the probe tip inputted in advance based on a result of measuring the CV property for the standard specimen having a known impurity distribution by said SCM measuring means, the shape data numerically expressing the shape of the probe tip, and SCM simulation means for determining the impurity distribution inside the measuring specimen based on a result of comparing the CV property for the measuring specimen calculated by using the shape data of the adjusted probe tip with the CV property for the measuring specimen measured by said SCM measuring means.

A semiconductor fabrication system, including a semiconductor fabrication apparatus, comprising:

• electric property measuring means for measuring the electric property of said semiconductor apparatus fabricated by said semiconductor fabrication apparatus;
• semiconductor evaluation apparatus for analyzing at least one of an impurity distribution and a surface shape, by using said semiconductor apparatus, said electric property of which is determined to be out of order by said electric property measuring means as the measuring specimen;
• fabrication condition error detecting means for detecting a deviation between fabrication conditions extracted conversely based on a result analyzed by the semiconductor evaluation apparatus and fabrication conditions detected by the fabrication condition error detecting means, and
• fabrication condition changing means for changing fabrication conditions in said semiconductor fabrication based on the deviation of the fabrication conditions detected by the fabrication condition error detect means, wherein:
• said semiconductor evaluation apparatus includes probe shape adjusting means for adjusting the shape data of the probe tip inputted in advance based on a result of measuring the surface shape of the standard specimen by said AFM measuring means, the shape data numerically expressing the shape of the probe tip, and AFM simulation means for determining the surface shape of the measuring specimen means for determining the surface shape of the measuring specimen based on a result comparing the surface shape of the measuring specimen calculated by using the shape data of the probe tip with the surface shape of the measuring specimen measured by said AFM measuring means.