In-plane MEMS thermal actuator and associated fabrication methods

A microelectromechanical (MEMS) actuator structure comprising:

• a microelectronic substrate having a first surface;
• at least two anchor structures affixed to the first surface of said microelectronic substrate;
• and
• at least two thermally actuated composite beams, each composite beam having a first layer with a first thermal coefficient of expansion and a second layer with a second thermal coefficient of expansion that is lower than the first thermal coefficient of expansion and each composite beam having a proximal end that is coupled to at least one of said anchor structures and a distal end overlying the first surface of said microelectronic substrate, wherein the distal ends of said at least two thermally actuated composite beams move substantially parallel to the first surface of said microelectronic substrate in a same direction that is toward the second layers of the at least two thermally actuated composite beams in response to heat applied thereto.

A system for MEMS thermal actuation in an in-plane direction, the system comprising:

• a voltage source;
• and
• a MEMS actuator device operably connected to said voltage source, said MEMS actuator device comprising:
• a microelectronic substrate having a first surface;
• at least one anchor structure affixed to the first surface, said at least one anchor structure having at least two electrical contacts;
• and
• a thermally actuated composite beam having a first layer with a first thermal coefficient of expansion and a second layer with a second thermal coefficient of expansion that is lower than the first thermal coefficient of expansion and having a proximal end that is coupled to said at least one anchor structure and a distal end overlying the first surface, said thermally actuated composite beam including an electrically conductive path electrically coupled to said voltage source, wherein the thermally actuated composite beam is heated by a current from said voltage source to the electrically conductive path via the electrical contacts, wherein the distal end moves substantially parallel to the first surface of said microelectronic substrate in a direction that is towards the second layer in response to the heat applied thereto.