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US 6,211,576 B1Granted
Semiconductor device
AssigneeHitachi, Ltd.
InventorsHiroya Shimizu, Asao Nishimura, Tosiho Miyamoto, Hideki Tanaka, Hideo Miura
Life of this patent
Estimating the term…
Abstract
A semiconductor device is provided which is highly reliable and operable at fast speed and low noises. In this semiconductor device, there are provided a power wiring section 1003a, a ground wiring section 1003b and a signal wiring section 1003c are formed on one level. The power wiring section or the ground wiring section is formed adjacently on both sides of at least one part of the signal wiring section.
Claims17
In a semiconductor device including:
- a semiconductor element having power pads for supplying a power potential, ground pads for supplying a ground potential, and signal pads for inputting and outputting a signal, all of which are formed on one main surface thereof;
- power bumps for outside connection being connected with said power pad by power wiring sections;
- ground bumps for outside connection being connected with said ground pad by ground wiring sections;
- and
- signal bumps for outside connection being connected with said signal pad by signal wiring sections,
- said semiconductor device characterized by locating said power wiring section or said ground wiring section adjacently on both sides of said signal wiring section.
3 more elements
In a semiconductor device including a plurality of pads formed on one main surface of a semiconductor element, a plurality of bumps, and a plurality of wiring sections for connecting said pads with said bumps,
- said semiconductor device characterized by:
- said plurality of pads being composed of power pads, ground pads and signal pads;
- said plurality of bumps being composed of power bumps, ground bumps and signal bumps;
- said plurality of wiring sections being composed of power wiring sections, ground wiring sections and signal wiring sections;
- and
- said power wiring section or said ground wiring section being located adjacently on both sides of at least part of said signal wiring section.
3 more elements
In a semiconductor device including:
- a semiconductor element having power pads for supplying a power potential, ground pads for supplying a ground potential and signal pads for inputting and outputting a signal, all of which are formed on one main surface thereof;
- power bumps for outside connection being connected with said power pads by power wiring sections;
- ground bumps for outside connection being connected with said ground pads by ground wiring sections;
- and
- signal bumps for outside connection being connected with said signal pads by signal wiring sections,
- said semiconductor device characterized in that each width of said power wiring section and said ground wiring section is wider than that of said signal wiring section and said power wiring section or said ground wiring section is located in a manner to cover an outer peripheral area of one main surface of said semiconductor element.
3 more elements
In a semiconductor device including:
- a semiconductor element having power pads for supplying a power potential, ground pads for supplying a ground potential and signal pads for inputting and outputting a signal, all of which are formed on one main surface thereof;
- power bumps for outside connection being connected with said power pads by power wiring sections;
- ground bumps for outside connection being connected with said ground pads by ground wiring sections;
- and
- signal bumps for outside connection being connected with said signal pads by signal wiring sections,
- said semiconductor device characterized by locating a pad sequence on a center of the one main surface of said semiconductor element, said pad sequence being composed of a repetition of a combination of one power pad, one ground pad and one signal pad along one side of an outer edge of said semiconductor element;
- connecting said one power pad with at least two power bumps located on both sides of said pad sequence by said power wiring sections;
- connecting said one ground pad with at least two ground bumps located on both sides of said pad sequence by said ground wiring sections;
- and
- connecting said one signal pad with said one signal pad located on either side of said pad sequence by said signal wiring sections.
7 more elements
In a semiconductor device including:
- a semiconductor element having power pads for supplying a power potential, ground pads for supplying a ground potential and signal pads for inputting and outputting a signal, all of which are formed on one main surface thereof;
- power bumps for outside connection being connected with said power pads by power wiring sections;
- ground bumps for outside connection being connected with said ground pads by ground wiring sections;
- and
- signal bumps for outside connection being connected with said signal pads by signal wiring sections,
- said semiconductor device characterized by including a pad sequence on the center of the one main surface of said semiconductor device, said pad sequence being composed of a sequence of a combination of one power pad, one ground pad and two or more signal pads along one side of an outer edge of said semiconductor element;
- connecting said one power pad with at least two power bumps located on both sides of said pad sequence by said power wiring sections;
- connecting said one ground bump with at least two ground bumps located on both sides of said pad sequence by said ground wiring sections;
- and
- connecting each of said two or more signal pads with said signal pads located on both sides of said pad sequence in a one-to-one manner by said signal wiring sections and alternately extending said signal wiring sections on both sides of said pad sequence.
7 more elements
Dependencies are inferred from the claim text.