Method and apparatus for testing chips
AssigneeFraunhofer-Gesellschaft zur Forderung der angewandten Forschung
InventorsElke Zakel, Frank Ansorge, Paul Kasulke, Andreas Ostmann, Rolf Aschenbrenner, Lothar Dietrich
Life of this patent
Estimating the term…
Abstract
Method and apparatus for the testing of substrates which are provided with a wiring structure, in particular, chips (21), in conjunction with which, by means of a solder-deposit carrier (25) which is provided with a structured, electrically conductive coating (12) with bond pads (17) for the arranging of solder deposits (28) and their transfer to correspondingly arranged bond pads (22) of a substrate (21), an electrical check of the wiring structure of the substrate (21) takes place during the transfer of the solder deposits (28).
Claims11
A solder-deposit carrier for the transfer of solder deposits to bond pads of a substrate which includes a wiring structure, said carrier having a carrier layer comprising an electrically conductive coating having bond pads in a preselected arrangement for receiving solder deposits to permit their transfer to correspondingly arranged bond pads on the substrate, said electrically conductive coating being formed as a wiring structure connected to said bond pads on the carrier.
Solder deposit for transfer from bond pads of a solder-deposit carrier, which is provided with a structured, electrically conductive coating, to bond pads of a substrate,
- characterized by
- a multiple-part design, with a base part (29) for placing on a bond-pad metallization (26) of the solder-deposit carrier (25), and a contact part (30) for contacting of a bond-pad metallization (22) of the substrate (21), in conjunction with which the melting temperature of the contact part (30) is less than the melting temperature of the base part (29).
Solder deposit in accordance with claim 910, characterized by the fact
- that base part (29) and the contact part (30) exhibit the same alloy components, and, unlike the base part, the contact part exhibits a eutectic material composition.
Dependencies are inferred from the claim text.