Integrated circuit package having stepped terminals
AssigneeRicoh Company, Ltd.
InventorHiromitsu Hatano
Life of this patent
Estimating the term…
Abstract
An integrated circuit package is configured to host an electric circuit chip therein and have connected thereto a set of external terminals that provide electrical connections between the electric circuit chip and components that are external to the integrated circuit package. The set of external terminals is arranged in subsets, where each subset includes a predetermined number of external terminals that are arranged in a stepped configuration, so as to reduce an overall size of the integrated circuit package.
Claims7
An integrated circuit package configured to hold an electric circuit chip therein, comprising:
- a plurality of external terminals arranged in subsets and being positioned with respect to one another at a same pitch;
- and a radiation plate configured to radiate heat and bear noise produced by said electronic circuit chip when disposed in said integrated circuit package,
- wherein respective of said external terminals in each subset being arranged with respect to one another in a stepped configuration and separated from one another by a predetermined distance and stacked in a common vertical direction when emerging from a side surface of said integrated circuit package;
- and
- at least one of said external terminals being connected to said radiation plate.
An IC package configured to hold an electric circuit chip therein, comprising:
- a plurality of external terminals arranged in subsets, respective of said subsets being positioned with respect to one another at a predetermined pitch, external terminals of each of said subsets being arranged in a common vertical direction and separated from one another by a predetermined distance;
- means for holding said plurality of external terminals in said subset in a predetermined fixed position;
- means for connecting said electric circuit chip to at least one external terminal of said subset of external terminals;
- means for suppressing heat radiation and noise generated by said electric chip;
- and
- means for connecting at least one of said plurality of external terminals to said means for suppressing heat radiation and noise.
Dependencies are inferred from the claim text.