Method and apparatus for component separation using microwave energy

A method for separating bonding material attached to a bonding area of a component from the component, comprising the steps of:

• directly and selectively applying microwave energy to said component so that substantially only said bonding material absorbs said microwave energy until said bonding material is at a debonding state, whereby said bonding material loses its bonding properties and the microstructure of the component is minimally affected to prevent destruction to the component;
• and,
• removing said bonding material from said component.

A cradling fixture for supporting components to be debonded using microwave energy, said components being attached together with a bonding material constituting an assembly, comprising:

• a first component holder for supporting at least a first of the components;
• and,
• a second component holder for receiving at least a second of the components, whereby at least the second of the components is supported by at least the first of the components, and after directly and selectively applying microwave energy to said assembly so that substantially only said bonding material absorbs said microwave energy until the bonding material reaches a debonding state, whereby said bonding material loses its bonding properties sufficient to permit separation by application of a separation force while said bonding material is at said debonding state of said components and the microstructure of said components is minimally affected to prevent destruction of said components so that at least the second of the components falls free to be received by said second component holder.