Printed circuit board and method of manufacturing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAkihito Hatakeyama, Seiichi Nakatani, Kouji Kawakita, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima
Life of this patent
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Abstract
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
Claims38
A method of manufacturing a printed circuit board, comprising:
- (a) laminating both sides of an uncured resin impregnated fiber sheet substrate material having voids with cover films;
- (b) forming through-holes in said uncured resin impregnated fiber sheet substrate material in a thickness direction by laser irradiation;
- (c) filling said through-holes with conductive paste;
- (d) removing said cover films and applying a metal foil on at least one side of said substrate material;
- (e) bonding said substrate material with said conductive paste by compressing and hardening said uncured resin impregnated fiber sheet substrate material through heating and pressurization;
- and
- (f) forming predetermined patterns on said metal foil.
A method of manufacturing a printed circuit board, comprising:
- (a) forming through-holes in a substrate material in the thickness direction by laser irradiation, said substrate material comprising a resin impregnated fiber sheet comprising voids;
- (b) filling said through-holes with a conductive paste to form an intermediate sheet;
- (c) disposing said intermediate sheet on at least one side of a core;
- (d) disposing a metal foil on said intermediate sheet;
- (e) bonding said intermediate sheet with said core and said metal foil;
- and
- (f) forming predetermined patterns on said metal foil.
A method of manufacturing a printed circuit board, comprising:
- (a) forming through-holes in a substrate material in the thickness direction by laser irradiation, said substrate material comprising a resin impregnated fiber sheet comprising voids;
- (b) filling said through-holes with a conductive paste to form an intermediate sheet;
- (c) disposing said intermediate sheet on at least one side of a first core;
- (d) disposing a second core on said intermediate sheet;
- and
- (e) bonding said intermediate sheet with said first core and said second core.
A method of manufacturing a printed circuit board, comprising:
- forming through-holes in a thickness direction of a substrate material comprising a resin and voids;
- filling said through-holes with conductive paste to form an intermediate sheet;
- applying a metal foil on at least one side of said intermediate sheet;
- and
- bonding said substrate material with said conductive paste.
Dependencies are inferred from the claim text.