Electronic circuit package with diamond film heat conductor
AssigneeSaint-Gobain Industrial Ceramics, Inc.
InventorPhilip M. Fabis
Life of this patent
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Abstract
An electronic circuit device package of the type having a metal laminate base flange of molybdenum clad with copper on both faces has a CVD diamond film substrate inlaid in a well in the bottom of the base flange so that it is flush with the base flange surface. An opening in the opposite side of the base flange forms a chamber with the diamond as a floor to which the device may be bonded in intimate contact with the diamond substrate. The edges of the diamond are brazed with a gold-indium braze in intimate thermal contact with a shoulder of the well to maximize heat conduction from the edges of the diamond into the base flange. The base flange may be fastened to the flat surface of a heat sink member with the diamond in intimate thermal contact with the heat sink member.
Claims14
A package for housing an electronic circuit device, comprising:
- a molybdenum base flange with a cladding comprising copper adapted to be fastened to a heat removal means, the base flange having a top face and a bottom face;
- an opening between the top face and bottom face of the base flange;
- a diamond substrate having a top and a bottom major surface disposed across the opening and fastened to the molybdenum of the base flange without intervening cladding.
Dependencies are inferred from the claim text.