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US 6,211,307 B1Granted
Organopolysiloxane composition for forming fired film
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMotoaki Iwabuchi, Masaaki Yamaya
Life of this patent
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Abstract
An organopolysiloxane composition comprising (A) 80-95 parts by weight of a silicone resin comprising units of R3SiO1/2 and SiO4/2 in a molar ratio of from 0.6/1 to 1.1/1, wherein R typically represents methyl, (B) 5-20 parts by weight of a diorganopolysiloxane, and (C) from more than 40 to 500 parts by weight of an organic solvent is applied to various substrates and fired into a ceramic film having improved heat resistance and adhesion.
Claims19
An organopolysiloxane composition suitable for forming a fired film, comprising
- (A) 80 to 95 parts by weight of a silicone resin comprising units of R3SiO1/2 and units of SiO4/2 in a molar ratio of from 0.6/1 to 1.1/1, wherein R, which may be the same or different, represents hydrogen, hydroxyl groups, alkoxy groups of 1 to 6 carbon atoms, or monovalent hydrocarbon groups of 1 to 6 carbon atoms,
- (B) 5 to 20 parts by weight of a diorganopolysiloxane represented by formula (1):
- wherein R1, which may be the same or different, represents hydrogen, hydroxyl groups, alkoxy groups of 1 to 6 carbon atoms, or monovalent hydrocarbon groups of 1 to 12 carbon atoms, and n is an integer of at least 1, the amount of components (A) and (B) combined being 100 parts by weight, and
- (C) from more than 40 to 500 parts by weight of an organic solvent.
1 more element
Dependencies are inferred from the claim text.