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AssigneeHitachi Chemical Company, Ltd.
InventorsTatsuo Kawata, Hiroki Sashima, Takaki Kashihara, Masanobu Fujii, Naoki Nara, Terumi Tsukahara, Hiroyuki Sakai
Estimating the term…
An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.
An encapsulating material for a lead-on-chip structure semiconductor, said encapsulating material comprising an epoxy resin, a curing agent for the epoxy resin, a curing accelerator, and an inorganic filler, said filler having a particle size of 90% or less of a distance between an inner lead and a semiconductor chip in the lead-on-chip structure semiconductor in the case of the distance being 70 μm or more, or having a particle size of 95% or less of the distance between an inner lead and a semiconductor chip in the case of the distance being less than 70 μm, and the amount of said filler being 80 to 95% by weight based on the total weight of the encapsulating material.
An encapsulating material for a lead-on-chip structure semiconductor, said encapsulating material comprising an epoxy resin, a curing agent for the epoxy resin, a curing accelerator, and an inorganic filler, said filler having a particle size of 90% or less of a distance between an inner lead and a semiconductor chip in the lead-on-chip structure semiconductor in the case of the distance being 70 μm or more, or having a particle size of 95% or less of the distance between an inner lead and a semiconductor chip in the case of the distance being less than 70 μm, and the amount of said filler being 80 to 95% by weight based on the total weight of the encapsulated material, wherein the curing accelerator is an adduct of triphenylphosphine and benzoquinone.
Dependencies are inferred from the claim text.