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US 6,211,127 B1Granted
Photoresist stripping composition
AssigneeSamsung Electronics Co., Ltd.
InventorsJin-Seock Kim, June-Ing Kil, Dong-Jin Park, Shang-Oa Park, Chun-Duek Lee, Seog-Young Lim, Yang-Sun Kim
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Abstract
A photoresist stripping composition suitable for both of the single wafer treatment method using an air knife process and a dipping photoresist stripping method. The composition comprises 5-15 weight % of alkanolamine, 35-55 weight % of sulfoxide or sulfone compound and 35-55 weight % of glycolether, and preferably further includes surfactant, and also 1-10 weight % of tetra methyl ammonium hydroxide or 3-15 weight % of benzenediol and 1-15 weight % of alkylsulfonic acid.
Claims9
A photoresist stripping composition, comprising:
- 5-15 weight % of alkanolamine;
- 35-55 weight % of sulfoxide or sulfone compound;
- and
- 35-55 weight % of glycolether.
1 more element
Dependencies are inferred from the claim text.