Method for detecting particles using illumination with several wavelengths
AssigneeApplied Materials, Inc.
InventorSagie Tsadka
Life of this patent
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AssigneeApplied Materials, Inc.
InventorSagie Tsadka
Estimating the term…
A process is provided for detecting small particles on wafer surfaces by irradiating the wafer surface with two light beams having a small difference in wavelength, collecting the light scattered by the wafer in at least one direction, separating the collected light into two component beams having the wavelengths of the irradiating beams, and comparing the intensities of the two component beams. The intensities of the component beams are transduced to digital signals which are fed to a comparator. An apparatus is also provided which comprises a stage for supporting a wafer, laser source and optics for generating two laser beams having different wavelengths, superimposing them and scanning the wafer with them, a sensor for sensing the light scattered by the wafer and separating it into two components having the said wavelengths, an A/D converter for generating digital signals corresponding to said components and a comparator for analyzing whether said signals indicate the presence of small particles.
A process for detecting small particles on the outside surface of an object, which comprises:
A process for detecting small particles on a wafer surface, chosen from among patterned and smooth areas of semiconductor surfaces, which comprises:
An apparatus for the detection of small particles on surfaces, particularly surfaces of patterned, semiconductor wafers, which comprises:
An apparatus for the detection of small particles on surfaces, particularly patterned or smooth surfaces of semiconductor wafers, which comprises:
Dependencies are inferred from the claim text.