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US 6,208,513 B1Granted
Independently mounted cooling fins for a low-stress semiconductor package
AssigneeCompaq Computer Corporation
InventorsJohn S. Fitch, William R. Hamburgen
Life of this patent
Estimating the term…
Abstract
In a semiconductor package, a die has electrical circuits formed on a first side surface. A lead frame for connecting the electrical circuits to a power source is connected to the electrical circuits of the die. A package body made of a dielectric material is formed around the die and the lead frame. One or more fins made of a thermally conductive material are independently attached to the die by a thermally conductive bond. The fins, receive heat directly from the die, and dissipate the heat by radiative or convection cooling into the surrounding environment.
Claims5
A semiconductor package, comprising:
- a die including electrical circuits;
- means for connecting the electrical circuits to a power source;
- a package made of a dielectric material, the package having the die and the means for connecting mounted therein such that a portion of the die forms an exterior surface of the package;
- a plurality of independent fins to dissipate heat into an environment external to the package, the plurality of independent fins made of a thermally conductive material;
- and
- means for independently attaching each of the plurality of independent fins to the portion of the die which forms the exterior surface of the package to provide a direct thermal path between the die and the plurality of independent fins positioned entirely outside the package to provide a low stress thermal joint between the plurality of independent fins and the die.
3 more elements
Dependencies are inferred from the claim text.