Multilayer microwave couplers using vertically-connected transmission line structures
AssigneeMerrimac Industries, Inc.
InventorJames J. Logothetis
Life of this patent
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Abstract
A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. Such a coupler has a vertically-connected stripline structure in which multiple sets of stripline layers are separated by interstitial groundplanes, and wherein more than one set of layers has a segment of coupled stripline. A typical implementation operates at frequencies from approximately 0.5 to 6 GHz, although other frequencies are achievable.
Claims16
A homogeneous multilayer structure comprising:
- a plurality of substrate layers defining levels and having surfaces;
- a plurality of metal layers disposed on said surfaces of said plurality of substrate layers;
- a plurality of groundplanes comprising a first subset of said plurality of metal layers connected by a plurality of transmission line structures;
- and
- at least one coupler comprising a plurality of coupler segments, wherein said plurality of coupler segments comprises a second subset of said plurality of metal layers connected by said plurality of transmission line structures, and wherein at least two of said plurality of coupler segments are on different levels.
A homogeneous multilayer structure comprising:
- a plurality of substrate layers defining levels and having surfaces;
- a plurality of metal layers disposed on said surfaces of said plurality of substrate layers;
- a plurality of groundplanes comprising a first subset of said plurality of metal layers connected by a first plurality of conductors;
- and
- at least one coupler comprising a plurality of coupler segments, wherein said plurality of coupler segments comprises a second subset of said plurality of metal layers connected by a second plurality of conductors, and wherein at least two of said plurality of coupler segments are on different levels;
- wherein said second plurality of conductors comprises slabline transmission lines.
A homogeneous multilayer structure comprising:
- substrate means for defining levels and surfaces;
- metal layer means disposed on said surfaces to define a plurality of conducting layers;
- grounding means comprising a first subset of said plurality of conducting layers;
- coupler means comprising a plurality of coupler segment means, wherein said plurality of coupler segment means comprises a second subset of said plurality of conducting layers, and wherein at least two of said plurality of coupler segment means are on different levels;
- and
- transmission line means for connecting said grounding means and said coupler segment means.
A homogeneous multilayer structure comprising:
- substrate means for defining levels and surfaces;
- metal layer means disposed on said surfaces to define a plurality of conducting layers;
- grounding means comprising a first subset of said plurality of conducting layers;
- first conducting means for connecting said grounding means;
- coupler means comprising a plurality of coupler segment means, wherein said plurality of coupler segment means comprises a second subset of said plurality of conducting layers, and wherein at least two of said plurality of coupler segment means are on different levels;
- and
- second conducting means for connecting said coupler segment means;
- wherein said second conducting means comprises slabline transmission lines.
Dependencies are inferred from the claim text.