Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems

A carrier for testing a semiconductor component having contact balls, comprising:

• a base;
• a plurality of contact members on the base, each contact member comprising a recess at least partially covered with a conductive layer configured to retain and electrically engage a contact ball on the component;
• and
• a plurality of terminal contacts on the base in electrical communication with the contact members;
• each terminal contact comprising a generally spherically shaped metal ball configured for multiple electrical engagements with a mating electrical connector of a test apparatus without substantial deformation;
• each terminal contact comprising a metal other than solder having a hardness greater than the contact balls, the metal selected from the group consisting of nickel, copper, beryllium copper, alloys of nickel, alloys of copper, alloys of beryllium copper, nickel-cobalt-iron alloys, and iron-nickel alloys.

A carrier for testing a semiconductor component having contact balls, comprising:

• a base having a first surface and an opposing second surface;
• a plurality of contact members on the second surface, each contact member comprising a recess at least partially covered with a conductive layer and configured to retain and electrically engage a contact ball on the component;
• and
• a plurality of terminal contacts on the first surface in electrical communication with the contact members configured to electrically engage matins electrical connectors on a test apparatus without substantial deformation;
• each terminal contact comprising a glass, ceramic or plastic member at least partially covered with a layer of a conductive material other than solder having a hardness greater than the contact balls.

A carrier for testing a semiconductor component having a plurality of contact balls in a ball grid array comprising:

• a base for retaining the component having a first surface and an opposing second surface;
• a plurality of contact members on the second surface for retaining and electrically engaging the contact balls on the component, each contact member comprising a recess at least partially covered with a conductive layer having an edge configured to penetrate a contact ball;
• and
• a plurality of terminal contacts on the first surface in electrical communication with the contact members, each terminal contact comprising a metal other than solder having a hardness greater than the contact balls and configured for multiple electrical engagements with an electrical connector of a test system without substantial deformation.

A system for testing a semiconductor component having contact balls comprising:

• a test socket comprising a plurality of electrical connectors in electrical communication with test circuitry;
• and
• a carrier configured to retain and electrically connect the component to the test socket, the carrier comprising:
• a base having a first surface and an opposing second surface, the base comprising a plurality of contact members on the second surface configured to make temporary electrical connections with the contact balls;
• a plurality of terminal contacts on the second surface in electrical communication with the contact members;
• each terminal contact comprising a metal other than solder having a hardness greater than the contact balls and configured for multiple electrical engagements with a mating electrical connector on the socket without substantial deformation.

A system for testing a semiconductor component having contact balls comprising:

• a test socket comprising a plurality of electrical connectors in electrical communication with test circuitry;
• and
• a carrier configured to retain and electrically connect the component to the test socket, the carrier comprising:
• a base comprising a first surface and an opposing second surface;
• a plurality of contact members on the second surface configured to make temporary electrical connections with the contact balls;
• a plurality of terminal contacts on the first surface in electrical communication with the contact members configured to electrically contact the electrical connectors without substantial deformation;
• and
• a plurality of conductive vias in the base electrically connecting the contact members and the terminal contacts;
• each terminal contact comprising a glass, ceramic or plastic member at least partially covered with a conductive layer comprising a metal other than solder having a hardness greater than the contact balls.