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US 6,208,031 B1Granted
Circuit fabrication using a particle filled adhesive
AssigneeFraivillig Technologies Company
InventorJames Fraivillig
Life of this patent
Estimating the term…
Abstract
A circuit assembly includes a substrate layer, a first conductive layer mounted to the substrate layer and a second conductive layer. The first and second conductive layers are adhered by an adhesive layer having non-electrically conductive particles for separating the first and second conductive layers.
Claims15
A circuit assembly comprising:
- a substrate layer comprising a material suitable for use as a flexible circuit and having a thickness selected to enable use as a flexible circuit substrate;
- a first conductive layer mounted to the substrate layer;
- a second conductive layer disposed on a side of said first conductive layer opposite a side of said first conductive layer mounted to said substrate layer;
- and
- an adhesive layer mounting the first and second conductive layers together, the adhesive layer having dielectric, thermally conductive particles for separating the first and second conductive layers, the particles comprising a ceramic material.
2 more elements
A circuit assembly comprising:
- a substrate layer;
- a first conductive layer mounted to the substrate layer;
- a second conductive layer disposed on a side of said first conductive layer opposite a side of said first conductive layer mounted to said substrate layer;
- and
- an adhesive layer mounting the first and second conductive layers together, the adhesive layer having dielectric, thermally conductive particles for separating the first and second conductive layers, said particles substantially devoid of void spaces therein, the particles comprising a ceramic material.
2 more elements
Dependencies are inferred from the claim text.