Temporary interconnect for semiconductor devices
AssigneeAdvanced Micro Devices, Inc.
InventorsJerrold Lynn King, Mohammad Khan
Life of this patent
Estimating the term…
Abstract
The present invention discloses a bump nest which allows a semiconductor device to be temporarily connected with a package without having to be fused to the package. The disclosed temporary interconnect includes a contact group comprising at least three projecting contact elements. Each of the respective contact elements includes a projecting contact guide, which is concentrically located on an encircling contact. The projecting contact guides and the encircling contact are spaced in a manner so as to surround a ball or a bump of the semiconductor device. In the preferred embodiment, the temporary interconnect may also include a base pad on which each of the encircling contacts is accurately positioned to surround the ball or bump.
Claims10
A temporary interconnect for connecting a bumped semiconductor to a package, comprising:
- a circular base pad;
- a contact group including at least three contact elements connected with said circular base pad, wherein each respective contact element includes a projecting contact guide integrally formed on an encircling contact, said at least three contacts being spaced to encompass a bump located on said bumped semiconductor to provide an electrical connection between said package and said bumped semiconductor.
A bump nest for interconnecting a bumped semiconductor with a package, comprising:
- a circular base pad;
- at least three contact elements connected with said circular base pad, each of said contact elements including an encircling contact and a projecting contact guide;
- and
- wherein said contact elements are positioned to surround a bump located on said bumped semiconductor to providing an electrical connection with said package.
A temporay interconnect for connecting a bumped semiconductor with a package, comprising:
- a cluster of contact pads spaced to guide a bump located on said bumped semiconductor into a conductive interface with at least one contact pad, wherein each of said contact pads includes an encircling contact with an integral projecting guide;
- and
- a circular base pad electrically connected with each respective contact pad, wherein each of said encircling contacts is spaced in an equilibrium triangle arrangement about a center axis of the circular base pad.
Dependencies are inferred from the claim text.