Electronic-circuit assembly
AssigneeNEC Corporation
InventorKoetsu Tamura
Life of this patent
Estimating the term…
Abstract
An electronic-circuit assembly according to the present invention comprises a first substrate on the upper surface of which a plurality of electrodes are provided. A second substrate is placed on the first substrate. The second substrate comprises a plurality of through-holes on the positions opposing to the plurality of terminals on the first substrate, respectively. The plurality of terminals on the first substrate are connected to the plurality of through-holes on the second substrate via a plurality of connecting members, respectively. A plate is placed on the upper surface of the second substrate. A plurality of pins which are provided on the under surface of the plate are inserted into the plurality of through-holes on the second substrate, respectively.
Claims16
An electronic-circuit assembly comprising:
- a first substrate having a plurality of terminals which are provided on the upper surface of said first substrate;
- a second substrate being provided on said first substrate, and having a plurality of through-holes which are provided on the positions opposing to said plurality of terminals, respectively;
- a plurality of connecting members for connecting said terminals on said first substrate to said through holes of said second substrate, respectively;
- a plate provided on the upper surface of said second substrate;
- and
- a plurality of pins each inserted into one of said through-holes of said second substrate;
- wherein each of said connecting members connects the corresponding one of said pins to the corresponding one of said through-holes;
- and
- wherein said plurality of pins keep the interval between said first substrate and said second substrate even.
The electronic-circuit assembly as claimed in claim 3, further comprising a resin provided in the interval between said first substrate and said second substrate for sealing said plurality of connecting members.
An electronic-circuit assembly comprising:
- a first substrate having a plurality of terminals which are provided on the upper surface of said first substrate;
- a second substrate being provided on said first substrate, and having a plurality of through-holes which are provided on the positions opposing to said plurality of terminals, respectively;
- a plurality of connecting members for connecting said terminals on said first substrate to said through holes of said second substrate, respectively;
- a plate provided on the upper surface of said second substrate;
- a plurality of pins each inserted into one of said through-holes of said second substrate;
- an electronic device provided on said second substrate;
- and
- a hole provided on said plate for receiving said electronic device;
- wherein each of said connecting members connects the corresponding one of said pins to the corresponding one of said through-holes;
- and
- wherein said plate is in close contact with said second substrate, and presses said second substrate toward said first substrate.
An electronic-circuit assembly comprising:
- a first substrate having a plurality of terminals which are provided on the upper surface of said first substrate;
- a second substrate being provided on said first substrate, and having a plurality of through-holes which are provided on the positions opposing to said plurality of terminals, respectively;
- a plurality of connecting members for connecting said terminals on said first substrate to said through holes of said second substrate, respectively;
- a plate provided on the upper surface of said second substrate;
- a plurality of pins each inserted into one of said through-holes of said second substrate;
- and
- a plurality of electrodes provided on the inner surfaces of said plurality of through-holes, respectively;
- wherein each of said connecting members connects the corresponding one of said pins to the corresponding one of said through-holes;
- and
- wherein said plurality of connecting members electrically connect said plurality of pins to said plurality of electrodes, respectively, and electrically connect said plurality of pins to said plurality of terminals of said first substrate, respectively.
An electronic-circuit assembly comprising:
- a first substrate having a plurality of terminals which are provided on the upper surface of said first substrate;
- a second substrate being provided on said first substrate, and having a plurality of through-holes which are provided on the positions opposing to said plurality of terminals, respectively;
- a plurality of conductive resins for connecting said terminals on said first substrate to through-holes on said second substrate, respectively;
- and
- insulation-resin provided between the first substrate and said second substrate for sealing said plurality of conductive resins.
An electronic-circuit assembly, comprising:
- a first substrate having a plurality of terminals which are provided on the upper surface of said first substrate;
- a second substrate being provided on said first substrate, and having a plurality of through-holes which are provided on the positions opposing to said plurality of terminals, respectively;
- a plurality of supporting members having bases, respectively, standing on the plurality of terminals via the bases, respectively, and being connected to respective parts of said second substrate for supporting between said first substrate and said second substrate at predetermined intervals;
- a connecting member for connecting each of said terminals, each of said through-holes and each of said supporting members, respectively;
- and
- insulation resin which is provided between said first substrate and said second substrate, and which seals said plurality of supporting members.
Dependencies are inferred from the claim text.